Researchers at Stanford University have developed silicon-based chips that can be mechanically stretched to cover an area up to 50 times larger than their original size. The technology, which was recently demonstrated at the International Electron Devices Meeting in Washington ...

A group of researchers at Clemson University recently developed a new process and equipment that is expected to significantly reduce the amount of heat generated by silicon chips used for speeding processors. As microprocessors tend to generate more heat at ...

The San Francisco based Company Kovio has recently announced the development of a new process for printing transistors for memory and logic chips, as well as analog devices for radio transmitters. Since the technology uses commercial printing equipment such as ...

Electrical engineers at the University of California in San Diego (UCSD) have developed the world’s most complex “phased array” – or radio frequency integrated circuit. Funded by the Defense Advanced Research Projects Agency (DARPA), this device is expected to find ...

Intel’s Photonic Lab has announced the successful development of the 3rd and last component in a high speed optical trinity – the Silicon-Germanium optical detector. Several months ago, Intel announced it had managed to combine a laser and an optical ...