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The VIA EPIA-T700 is the first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer on module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications. With customized carrier boards connected using ultra low profile 3mm connectors, the VIA EPIA-T700 takes advantage of the modular design principles inherent in Mobile-ITX form factor specification. |
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The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer industry-leading I/O flexibility in the most compact of available form factors. The VIA EPIA-T700 features 512MB of DDR2 on-board system memory and an integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA. The VIA EPIA-T700 uses two unique high density, low profile connectors on the underside of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
(Source: Via) |
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