Researchers at Intel, Arizona State University in Tempe, RTI International, and Nextreme Thermal Solutions reported Sunday that a small thermoelectric device embedded in a chip package could cool a much larger chip. The thermoelectric chiller, a device that pumps heat when current flows through it, cooled a 0.16-square-millimeter hot spot on a 140-mm2 chip by nearly 15 °C. The researchers say it was the first demonstration of viable chip-scale refrigeration technology. (source: spectrum.ieee.org)
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