Scientists have developed a new form of stretchable silicon integrated circuit that can wrap around complex shapes such as spheres, body parts and aircraft wings, and can operate during stretching, compressing, folding and other types of extreme mechanical deformations, without a reduction in electrical performance. The new designs and fabrication strategies could produce wearable systems for personal health monitoring and therapeutics, as well as systems that wrap around mechanical parts. (source: news.uiuc.edu)
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